 |
|
| • CMOS output |
| • Wide supply voltage: 2.7V to 5.5V |
| • Low power supply current IDD: 1.1 mA/channel max. |
| • Low forward current IF: 1.6 mA min. |
| • Speed: 5 MBd typ. |
| • Pulse width distortion (PWD): 200 ns max. |
| • Propagation delay skew (tpsk): 220 ns max. |
| • Propagation delay (tp): 250 ns max. |
| • Common mode rejection: 25 kV/µs min. at VCM =
1000V |
| • Hysteresis: 0.2 mA typ. |
| • Temperature range: –40°C to +105°C |
• Safety and regulatory approvals
– UL 1577 recognized: 3750 VRMS for 1 minute for
ACPL-M21L/021L/024L and 5000 VRMS for 1 minute
for ACPL-W21L/K24L
– CSA Approval
– IEC/EN 60747-5-5, Approval for Reinforced
Insulation |
|
| CATALOG |
| ACPL-024L-000E COUNTRY OF ORIGIN |
| ACPL-024L-000E PARAMETRIC INFO |
| ACPL-024L-000E PACKAGE INFO |
| ACPL-024L-000E MANUFACTURING INFO |
| ACPL-024L-000E PACKAGING INFO |
| ACPL-024L-000E APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
|
| PARAMETRIC INFO |
| Input Type |
DC |
| Output Type |
Push-Pull |
| Polarity |
Non-Inverting |
| Direction Type |
Uni-Directional |
| Standard |
CSA|DIN|EN|IEC|UL|VDE |
| Logic Gate Type |
AND Schmitt |
| Number of Channels per Chip |
2 |
| Maximum Data Rate |
5MBd(Typ) |
| Typical Forward Voltage (V) |
1.5 |
| Maximum Working Insulation Voltage (V) |
567 |
| Maximum Propagation Delay Time (tPLH) (ns) |
250 |
| Maximum Propagation Delay Time (tPHL) (ns) |
250 |
| Common Mode Voltage (V) |
1000 |
| Minimum Common Mode Rejection (kV/us) |
25 |
| Maximum Pulse Width Distortion (ns) |
200 |
| Maximum Propagation Delay Skew (ns) |
220 |
| Maximum Forward Voltage (V) |
2 |
| Maximum Forward Current (mA) |
8 |
| Maximum Reverse Voltage (V) |
5 |
| Maximum Continuous Output Current (mA) |
10 |
| Maximum Power Dissipation (mW) |
600 |
| Minimum Isolation Voltage (Vrms) |
3750 |
| Typical Rise Time (us) |
0.011 |
| Typical Fall Time (us) |
0.011 |
| Maximum Propagation Delay Time (ns) |
250 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Supply Voltage (V) |
2.7 |
| Maximum Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SO |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5.08 |
| Package Width (mm) |
3.98 |
| Package Height (mm) |
3.18 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
3.39 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
| |
| PACKAGING INFO |
|
|
| |
| APPLICATIONS |
| • Low isolation of high speed logic systems |
| • Computer peripheral interface |
| • Microprocessor system interface |
| • Ground loop elimination |
| • Pulse transformer replacement |
| • High-speed line receiver |
| • Power control systems |
| |
| |
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