XC7Z035-1FFG676I AMD / Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA

label:
13/03/2025 0
XC7Z035-1FFG676I AMD / Xilinx 	IC SOC CORTEX-A9 KINTEX7 676BGA


CATALOG
XC7Z035-1FFG676I PARAMETRIC INFO
XC7Z035-1FFG676I PACKAGE INFO
XC7Z035-1FFG676I MANUFACTURING INFO


PARAMETRIC INFO
Device Logic Cells 275000
Maximum Number of User I/Os 128
Number of I/O Banks 4
Device Number of DLLs/PLLs 8
Number of Multipliers 900 (25×18)
Number of Regional Clocks 4
Tradename Zynq®
Number of Registers 343800
RAM Bits (Kbit) 2000
Total Number of Block RAM 500
Program Memory Type SRAM
Family Name Zynq®-7000
Process Technology 28nm
Speed Grade 1
Transceiver Speed (Gbps) 12.5
Dedicated DSP 900
Differential I/O Standards Supported LVDS|SSTL|HSTL
Ethernet MACs 2
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability Yes
Reprogrammability Support No
Number of Global Clocks 32
Maximum Operating Supply Voltage (V) 1.05
I/O Voltage (V) 1.2|1.35|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Opr
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 0.95
Typical Operating Supply Voltage (V) 1
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package FCBGA
Basic Package Type Ball Grid Array
Pin Count 676
Lead Shape Ball
PCB 676
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 27
Package Width (mm) 27
Package Height (mm) 2.4(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 3(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Flip Chip Ball Grid Array
Package Family Name BGA
Jedec MS-034AAL-1
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 4
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A

produtos RFQ